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HTC Heat Transfer Compound

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Product Details:

Thermal Conductivity	0.8 W/mK
Form	Paste
Electrical Property	Insulating
Application	Inverter
Viscosity	Medium
Temperature Range	-50 to 150 C

Electrolube HTC is a non-silicone, non-curing thermal interface material designed for efficient heat dissipation between electronic components and heat sinks. It features a high thermal conductivity of , a wide operating temperature range of to , and excellent non-creep characteristics. It is ideal for high-power applications where silicone contamination must be avoided. MacDermid Alpha +2

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