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Thermal Compounds
Our product range includes a wide range of dow corning tc 5080, dow corning tc 5026 thermal compound, dow corning tc 5625 thermal compound, dow corning tc 5629 thermal compound, dow corning tc 5622 and white dow corning tc 5121.
Dow Corning Tc 5080
Product Price: Rs 10,200 / KgGet Best Price
Product Brochure
Product Details:
| Packaging Size | 1 kg |
| Packaging Type | Can |
| Application Industry | Automotive , Electronics |
| Surface Of Application | Metal |
| Country of Origin | Made in India |
FEATURES:
- High thermal conductivity
- Low oil bleed
- Stable at high temperatures
POTENTIAL USES:
- Gap fill between heat sinks and:
- Transistors
- Diodes
- Rectifier bases
- Other heat sources
APPLICATION METHODS:
- Screen print
- Stencil print
- Needle dispense
Additional Information:
- Packaging Details: In Stock
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Dow Corning TC 5026 Thermal Compound
Product Price: Rs 10,000 / KgGet Best Price
Product Brochure
Product Details:
| Packaging Size | 1 kg |
| Packaging Type | Bucket |
| Application Industry | Automotive |
| Surface Of Application | Ceramic |
| Country of Origin | Made in India |
FEATURES:
- Premium performance
- Ultra thin bond lines, independent of pressure
- Solvent free for better stability and storage
BENEFITS:
- Small particle size allows extremely thin bond lines
- Pump-out resistant
COMPOSITION:
- Polydimethylsiloxane compound
APPLICATION METHODS:
- Screen print
- Stencil print
- Dispense
Additional Information:
- Packaging Details: In Stock
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Dow Corning TC 5625 Thermal Compound
Product Price: Rs 7,400 / KgGet Best Price
Product Brochure
Product Details:
| Packaging Size | 1 kg |
| Packaging Type | Can |
| Application Industry | Electronics, Automotive |
| Country of Origin | Made in India |
FEATURES:
- Flowable
- Outstanding thermal conductivity
BENEFITS:
- No need for ovens or curing
- Heat flow away from electronic components can increase reliability
POTENTIAL USES:
- Thermal management material for LED devices
APPLICATION METHODS:
- Screen print
- Stencil print
Additional Information:
- Packaging Details: In stock
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Dow Corning Tc 5629 Thermal Compound
Product Price: Rs 11,800 / KgGet Best Price
Product Brochure
Product Details:
| Packaging Type | Bottle |
| Application Industry | Electronic & Automotive |
| Surface Of Application | Plastic |
| Country of Origin | Made in India |
FEATURES & BENEFITS • High thermal conductivity • Good stability on vertical surfaces • Thermally conductive solution for LED lightings and other electronics applications • Vertical gap-fill capability up to 1.0 mm COMPOSITION
Additional Information:
- Packaging Details: In stock
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Dow Corning TC 5622
Product Price: Rs 10,000 / KgGet Best Price
Product Brochure
Product Details:
| Packaging Size | 1 kg |
| Packaging Type | Can |
| Application Industry | Electronics |
| Country of Origin | Made in India |
Features:
- Solvent-free formulation
- Easy application
- Good stability and reliability
Applications:
- Thermal interface material for a variety of devices in electronics and other industrial applications
Potential Applications:
- Microprocessors
- LED assemblies
- Power modules
- Download the DOWSIL TC-5021 technical data sheet (TDS) and the DOWSIL TC-5021 safety data sheet (SDS) from Silmid today. Once you have logged in or signed up, the datasheet will be visible for download if one is available.
Additional Information:
- Packaging Details: In Stock
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White Dow Corning TC 5121
Product Price: Rs 11,650 / KgGet Best Price
Product Brochure
Product Details:
| Packaging Size | 1 kg |
| Packaging Type | Can |
| Application Industry | Electronics |
| Country of Origin | Made in India |
Features and Benefits:
- Optimized polymer matrix to help reduce pump out
- Flowable
- Good thermal conductivity
- Low thermal resistance
- Non-curing, no need for curing ovens
- Heat removal from electronic components
- Can achieve thin Bond Line Thickness (BLT)
Composition:
Filled polydimethylsiloxane Grey, flowable, non-curing thermally conductive compound
Applications:
Dow Corning® TC-5121 Thermally Conductive Compound is suitable for use as an interface material for a variety of mid to high end electronic devices.
Additional Information:
- Packaging Details: In stock
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